[PDF.04kv] Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)

Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)

[PDF.ew42] Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)

Advances in Chemical Mechanical  Suryadevara Babu epub
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 | #1306030 in Books |  2016-01-22 | Original language:English | PDF # 1 |  9.02 x1.19 x5.98l,3.51 | File type: PDF | 536 pages

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||About the Author|Suryadevara Babu is distinguished professor and director of CAMP at Clarkson University, USA. His research interests include CMP of Cu, Ta and SiO2, CMP for shallow-trench isolation, particle-free solutions for CMP and post-CMP cleaning.

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improv...

You can specify the type of files you want, for your gadget.Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)   |  Suryadevara Babu. A good, fresh read, highly recommended.

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